Electrical Performance Of Electronic Packaging

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Electrical Performance of Electronic Packaging

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Author by : no defined
Languange Used : English, France, Spanish, Italia and chinese
Page : 233
Isbn :
Identifier : UIUC:30112043461992
Release : 2004
Publisher by : no defined
Category : Electronic packaging
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Electrical Performance of Electronic Packaging November 2-4, 1994, Monterey Plaza Hotel, Monterey, California

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Author by : no defined
Languange Used : English, France, Spanish, Italia and chinese
Page : 233
Isbn :
Identifier : OCLC:1144365155
Release : 1994
Publisher by : no defined
Category : Electronic packaging
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IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging October 24-26, 2005, Radisson Hotel & Suites Town Lake, Austin, Texas

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Author by : no defined
Languange Used : English, France, Spanish, Italia and chinese
Page : 233
Isbn :
Identifier : OCLC:261196078
Release : 2005
Publisher by : no defined
Category :
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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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Author by : IEEE Staff
Languange Used : English, France, Spanish, Italia and chinese
Page : 233
Isbn : 9781728145860
Identifier : 1728145864
Release : 2019-10-06
Publisher by : no defined
Category :
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Description : Read Now 2019 Ieee 28th Conference On Electrical Performance Of Electronic Packaging And Systems Epeps by IEEE Staff and you can download with pub, pdf, txt, doc, and more file format with free account. epeps is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems it also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs epeps is jointly sponsored by the ieee electronics packaging society, ieee microwave theory and techniques society, and ieee antenna and propagation society

IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging October 20-22, 1993, Hyatt Regency Monterey, Monterey, California

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Author by : no defined
Languange Used : English, France, Spanish, Italia and chinese
Page : 233
Isbn :
Identifier : OCLC:63177490
Release : 1993
Publisher by : no defined
Category : Electronic packaging
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Electronic Packaging Materials and Their Properties

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Author by : Michael Pecht
Languange Used : English, France, Spanish, Italia and chinese
Page : 128
Isbn : 9780849396250
Identifier : 0849396255
Release : 1998-12-18
Publisher by : CRC Press
Category : Technology & Engineering
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Description : Read Now Electronic Packaging Materials And Their Properties by Michael Pecht and you can download with pub, pdf, txt, doc, and more file format with free account. packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. in electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. electronic packaging materials and their properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders electronic packaging materials and their properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

The Electronic Packaging Handbook

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Author by : Glenn R. Blackwell
Languange Used : English, France, Spanish, Italia and chinese
Page : 640
Isbn : 9781420049848
Identifier : 1420049844
Release : 2017-12-19
Publisher by : CRC Press
Category : Technology & Engineering
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Description : Read Now The Electronic Packaging Handbook by Glenn R. Blackwell and you can download with pub, pdf, txt, doc, and more file format with free account. the packaging of electronic devices and systems represents a significant challenge for product designers and managers. performance, efficiency, cost considerations, dealing with the newer ic packaging technologies, and emi/rfi issues all come into play. thermal considerations at both the device and the systems level are also necessary. the electronic packaging handbook, a new volume in the electrical engineering handbook series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. co-published with the ieee, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. topics addressed include design automation, new ic packaging technologies, materials, testing, and safety. electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. these demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. the electronic packaging handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

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Author by : Yong Liu
Languange Used : English, France, Spanish, Italia and chinese
Page : 594
Isbn : 1461410525
Identifier : 9781461410522
Release : 2012-02-15
Publisher by : Springer Science & Business Media
Category : Technology & Engineering
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Description : Read Now Power Electronic Packaging by Yong Liu and you can download with pub, pdf, txt, doc, and more file format with free account. power electronic packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. since there is a drastic difference between ic fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (ic) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. this book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. the author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Advanced Electronic Packaging

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Author by : William D. Brown
Languange Used : English, France, Spanish, Italia and chinese
Page : 812
Isbn :
Identifier : STANFORD:36105114517258
Release : 2006-02-24
Publisher by : Wiley-IEEE Press
Category : Technology & Engineering
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Description : Read Now Advanced Electronic Packaging by William D. Brown and you can download with pub, pdf, txt, doc, and more file format with free account. this book updates the book, advanced electronic packaging: with emphasis on multichip modules, ed. w.d. brown, ieee press, copyright 1999. the original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.

Practical Guide to the Packaging of Electronics, Second Edition Thermal and Mechanical Design and Analysis

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Author by : Ali Jamnia
Languange Used : English, France, Spanish, Italia and chinese
Page : 320
Isbn : 1439870926
Identifier : 9781439870921
Release : 2008-11-20
Publisher by : CRC Press
Category : Technology & Engineering
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Description : Read Now Practical Guide To The Packaging Of Electronics Second Edition by Ali Jamnia and you can download with pub, pdf, txt, doc, and more file format with free account. as the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. practical guide to the packaging of electronics: second edition, thermal and mechanical design and analysis provides a basic understanding of the issues that concern the field of electronics packaging. first published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. this volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. dr. ali jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. he has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. by consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.

Handbook Of Electronics Packaging Design and Engineering

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Author by : Bernard S. Matisoff
Languange Used : English, France, Spanish, Italia and chinese
Page : 656
Isbn : 9401170479
Identifier : 9789401170475
Release : 2012-12-06
Publisher by : Springer Science & Business Media
Category : Juvenile Nonfiction
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Description : Read Now Handbook Of Electronics Packaging Design And Engineering by Bernard S. Matisoff and you can download with pub, pdf, txt, doc, and more file format with free account. the handbook of electronics packaging design and engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. it is designed to provide a single convenient source for the solution of re curring design problems. the primary consideration of any design is that the end product meet or exceed the applicable product specifications. the judicious use of uniform design practices will realize the following economies and equipment improvements: • economics of design. uniform design practices will result in less engineering and design times and lower costs. they will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. • improved design. better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. • production economies. uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. the handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. it attempts to present electronics packaging as it is today. it can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.

Electrically Conductive Adhesives

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Author by : Rajesh Gomatam
Languange Used : English, France, Spanish, Italia and chinese
Page : 426
Isbn : 9004165924
Identifier : 9789004165922
Release : 2008-12-23
Publisher by : BRILL
Category : Technology & Engineering
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Description : Read Now Electrically Conductive Adhesives by Rajesh Gomatam and you can download with pub, pdf, txt, doc, and more file format with free account. this book is based on two special issues of the journal of adhesion science and technology (jast vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. the contains a total of 21 papers (reflecting overviews and original research).